Inbrain Neuroelectronics · Barcelona
Senior Advanced Packaging Engineer
YOUR MISSION We are scientists, doctors, techies and humanity lovers, with the mission of building neuroelectronic interfaces to cure brain disorders. INBRAIN...
YOUR MISSION
We are scientists, doctors, techies and humanity lovers, with the mission of building neuroelectronic interfaces to cure brain
disorders. INBRAIN harnesses the extraordinary material properties of Graphene, the world’s thinnest and nobel-prize winning
material, to build safe, uninvasive and highly efficient neural solutions. Our mission is to decode and modulate neural networks
to improve people's lives
As a Senior Advanced Packaging Engineer, you will be the technical architect of metrology, electrical test and data analysis
infrastructure. The primary goal is to invent, build and operate the automated test systems required to characterize complex
vertical integration processes (advanced packaging, TGV, electromechanical reliability).
You will be at the forefront of bringing advanced healthcare solutions to market, making a tangible difference in people´s lives
worldwide.
This position will be office-based in Bellaterra.
YOUR PROFILE
Main responsibilities:
- Test Strategy & Equipment Setup: Define and deploy the test infrastructure required to characterize 3D MEMS process steps
thermal bonding, wafer-level packaging, TGV, electrochemical or mechanical reliability testing. Specify, qualify and operate
metrology, electrical test, and reliability equipment.
- Process Characterization & DOEs: Design and execute structured experiments to characterize 3D MEMS unit processes and
integrated flows. Generate the data needed to set process windows, control limits, and acceptance criteria across coupled
process steps.
- Data Analysis & Industrialization: Build Python-based data pipelines to analyze high-volume process and test data. Extract
yield, Cpk, drift, and failure-mode signatures. Translate findings directly into process and test recipe improvements.
- Hardware & Electrical Characterization: Lead electrical and physical characterization across 3D MEMS structures. Use SMUs,
DAQs, oscilloscopes, probe stations, and dedicated MEMS test rigs to measure critical parameters at the required precision.
- Materials & Failure Analysis: Apply materials science fluency, thin films, interfaces, integration physics, to root-cause
analysis on failures across, bonding, packaging, TGV interfaces and electromechanical reliability. Feed findings back to
process and design teams to drive iterations.
- Cross-Functional Coordination: Work directly with Process Integration, Packaging, Hardware, mechanical and Software teams to
align test requirements, hardware specifications, and data infrastructure. Translate 3D MEMS physics into testable
specifications across disciplines.
- Industrialization & Scaling: Take prototype test setups out of R&D and harden them for pilot and production. Author SOPs,
qualify equipment (IQ / OQ / PQ), and integrate with MES where applicable.
- Continuous Improvement: Identify opportunities to reduce variation, improve test throughput, and tighten the link between
process control and electrical / yield outcomes across the 3D MEMS stack.
Mandatory Qualifications and Soft skills:
- Bachelor’s or Master’s degree in Electrical Engineering, Applied Physics, Materials Science, Microelectronics, or a related
field.
- 5+ years in Test Development, Device Characterization, or Yield Engineering within a semiconductor, MEMS, or advanced packaging
environment.
- Vertical Integration & MEMS Expertise: Hands-on experience with testing and characterizing advanced packaging architectures,
including wafer-level thermal bonding, Through-Glass Vias (TGV) / TSV metallization, and electromechanical reliability.
- Data Science & Scripting: High proficiency in Python (e.g., Pandas, NumPy, SciPy) for complex data analysis, instrument control
(SCPI/VISA), and automating high-volume, lot-level data workflows.
- Test Equipment & Instrumentation: Hands-on expertise building test setups with SMUs, DAQs, oscilloscopes, and automated
metrology tools. Highly capable of debugging signal integrity for low-noise/high-impedance analog measurements.
- Physics of Failure: Deep understanding of semiconductor/MEMS device physics, thin films, and electromechanical integration.
Must understand why an interface fails (e.g., CTE mismatch, delamination, voiding) to design accurate test traps.
- Industrialization Track Record: Proven ability to take prototype test platforms out of R&D and industrialize them for pilot or
production use, including authoring SOPs and executing equipment qualification (IQ/OQ/PQ).
- Systematic, first-principles approach to problem-solving.
- A strong instinct for identifying R&D fragility.
- Strong written and verbal communication.
- Takes full ownership of test strategy, equipment readiness, and data quality.
- Thrives in fast-moving, unstructured deep-tech environments.
Nice to have (optional):
- Database Architecture: Experience interfacing automated test hardware with Manufacturing Execution Systems (MES) or SQL
databases, and building visual dashboards (e.g., Grafana, PowerBI) for tracking yield and Cpk.
- Reliability & Environmental Testing: Practical knowledge of accelerated aging models, hermeticity testing (leak rate analysis),
and Electrochemical Impedance Spectroscopy (EIS).
- Neurotechnology & Mixed-Signal Electronics: Familiarity with high-channel-count analog front-ends (AFEs), custom ASICs, or
complex neural electrophysiology signal chains.
- Statistical Process Control: Working knowledge of PFMEA, DOE methodology, SPC, and Cpk-driven process control in regulated
manufacturing environments.
- Pilot-to-Production Scaling: Prior experience supporting a deep-tech hardware company through a pilot-to-production transition,
including capital tooling and scale-up decisions.
WHY US?
We are looking for someone who Is ready to proactively bring new ideas to the team, push boundaries, and constantly look for
innovation. At INBRAIN we believe in shared success and diverse ways of thinking, here you'll learn, grow, and advance in an
innovative culture.
WHAT CAN WE OFFER TO YOU?
- A collaborative environment where innovative ideas flourish and teamwork drives us forward. At INBRAIN, we believe the power of
collective intelligence is unique. You will be part of a team that thrives on open communication, knowledge sharing and mutual
respect.
- Meaningful Work Impact: Our projects are not only exciting and challenging but also have a positive impact on the industry and
society as a whole. You'll be part of a team that strives to create meaningful change.
- Cutting-Edge Technology Exposure: Joining us means immersing yourself in the latest technologies and innovative solutions.
You'll have access to state-of-the-art tools and resources, fostering continuous learning and keeping your skills relevant in a
rapidly evolving industry.
- Competitive salary (according to your experience/skills)
- Internal flexible compensation scheme
- Private Health Insurance
- Training bonus for professional development and access to Udemy platform
- 23 vacation days per year
- Christmas week off
- While we offer flexible working modality, because of the nature of this position, this will be an office-based position in
Bellaterra.
Applications must be submitted in English
At INBRAIN, we're not just offering a job – we're inviting you to be part of a transformative journey, Are you ready to transform
lives? Join us!
#diverseandinclusive
We believe that a diverse and well-balanced workforce drives innovation. At INBRAIN, we foster the inclusion of all people
regardless of culture, age, gender, sexual orientation and identity, or any other status
Role
Senior Advanced Packaging Engineer
Category
Microfabrication
Location
Published
July 23
Deadline
August 22
Source