Master's Thesis: Advanced AI Accelerators

Founded in 1987, Huawei Technologies has grown into a global leader in telecommunications and network solutions, with innovation

at the core of everything we do. Huawei established its first overseas R&D office in Sweden in 2000, and since then, we’ve

expanded rapidly. Today, over 400 R&D engineers are pushing boundaries in Stockholm, Gothenburg, and Lund, working on

groundbreaking 6G wireless systems that shape tomorrow’s technology.

Join us on our journey to develop the future of tech and be a part of a team that thrives on innovation, works hard to solve the

industry’s biggest challenges, and collaborates with top engineers worldwide. If you’re ready to contribute to world-changing

advancements, we want you on board!

AI accelerators face two major challenges: the memory wall and the thermal wall. While 3D integration offers a promising solution

to the memory wall, it can exacerbate thermal challenges. This project aims to develop a simulation framework for evaluating the

power and thermal characteristics of 3D-integrated computing systems employing conventional and emerging memory technologies, such

as advanced SRAM and MRAM. The work involves integrating architectural simulators, such as gem5, with power estimation models and

thermal simulation tools, such as HotSpot. The developed framework will be used to investigate the impact of memory technologies,

reinforcement based task scheduling and workload characteristics on power consumption, performance, and temperature distribution

of the AI SoC.

• Background: Background in Computer Engineering, Electrical Engineering and basic knowledge of computer architecture and

programming (Python/C++).

• Desirable Experience: Familiarity with simulation tools (gem5, HotSpot, McPAT). Knowledge of memory technologies and 3D

integration.

Are you ready to apply your skills in a real-world setting and help us lead the charge in tech innovation? Join Huawei Sweden R&D,

and let’s make tech history together!