Master's Thesis: NanoFlat-Metallization for Radio Frequency Low-Loss Devices

Founded in 1987, Huawei Technologies has grown into a global leader in telecommunications and network solutions, with innovation

at the core of everything we do. Huawei established its first overseas R&D office in Sweden in 2000, and since then, we’ve

expanded rapidly. Today, over 400 R&D engineers are pushing boundaries in Stockholm, Gothenburg, and Lund, working on

groundbreaking 6G wireless systems that shape tomorrow’s technology.

Join us on our journey to develop the future of tech and be a part of a team that thrives on innovation, works hard to solve the

industry’s biggest challenges, and collaborates with top engineers worldwide. If you’re ready to contribute to world-changing

advancements, we want you on board!

With the rapid development of radio-frequency (RF) and high-frequency electronic devices toward higher operating frequencies and

lower transmission losses, the surface roughness of metallic conductors has become a critical factor affecting signal integrity

and energy dissipation. In particular, on common insulating substrates such as glass, ceramics, and polymers, conventional

fabrication processes often struggle to simultaneously achieve ultra-low surface roughness and long-term stability of the metal

films, posing a significant limitation on device performance.

Against this background, this project aims to recruit a master’s student focused on achieving ultra-low surface roughness and

reliable metallization on glass, ceramic, and polymer substrates. The main research objectives are:

• Surface smoothing – exploring and optimizing techniques such as chemical–mechanical polishing and plasma treatments, etc. to

significantly reduce substrate surface roughness.

• Reliable metallization – developing robust, low-loss metal deposition strategies (e.g., sputtering, electroplating, seed-layer

engineering) to ensure excellent electrical conductivity and strong adhesion of metal films under high-frequency operating

conditions.

The outcomes of this work will provide key process support for the next generation of low-loss RF and microwave devices. This role

offers a unique opportunity to collaborate closely with cutting-edge engineering teams in Sweden and Huawei’s HQ in China, while

also conducting hands-on research in university labs.

• Desirable Experience: Chemical Mechanical Planarization, Metallization of Ultra-Smooth Ceramic and Glass Substrates.

Familiarity with multicultural and international work settings, and experience in a lab/testing environment.